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The Sofradir 480 x 6 Long Wave (LW) Time Delay & Integration (TDI) Infrared Focal Plane Assembly (IRFPA) is offered to answer the requirements of band III (8-12µm) detection of high resolution (FLIR, IRST, surveillance,…) military scanning systems.
This IRFPA takes advantage of the Sofradir high performance, stable, low defect density Photo-Voltaic HgCdTe technology, hybridized on a Sofradir state of the art CMOS Read-Out Integrated Circuit (ROIC).
This IRFPA is offered in long vacuum-life Dewar with split Stirling Coolers, in order to meet the mechanical and cooling needs of the systems.
Standard configurations
- Integrated Detector Dewar Cooler Assembly (IDDCA) with 1 W LS10-11i split Stirling-cycle linear cooler.
Applications
HTI Second Generation FLIR
Data sheet (pdf)Array Features
| Detector pitch | 49.8 µmx25.4 µm | |
| Material spectral response | 0.8 µm - 10.3 µm | |
| Detector spectral response | 7.7 µm up to material cut-off (high pass cold filter) | |
| FPA Operating Temperature | 77K to 80K | |
ROIC Features
Selection:
Parallel or serial electrical interface
Modes:
Snap shot operation, direct injection input circuit, simultaneous mode (integrate while read), programmable integration time, bi-directional TDI scanning, programmable pixel deselection
Max charge handling capacity :
eight gains from 0.6 to 12.5 Million e- (for 100% well fill)
Number of output : 16
Pixel output rate : up to 4 MHz per output